Chiplet互连之争：UCIe何以胜出？

Core Viewpoint - The UCIe 2.0 standard for die-to-die interconnects in advanced packaging has raised concerns about its complexity, but many of its new features are optional, allowing for customization based on specific needs [1][2][3] Group 1: UCIe 2.0 Features and Flexibility - UCIe 2.0 introduces optional features that are not necessary for internal designs, which dominate the current chiplet market [2][6] - The standard provides flexibility similar to PCIe and CXL, allowing companies to implement only the features they require [2][5] - Most of the new features in UCIe 2.0 are management-related, aimed at ensuring startup and composability, but they are not mandatory [7][9] Group 2: Market Dynamics and Competition - The current advanced packaging products are primarily developed by well-funded companies that control all components, limiting the need for interoperability with externally sourced chiplets [3][17] - There is ongoing competition between UCIe and Bunch of Wires (BoW), with both standards having their proponents and potential applications [15][17] - The UCIe Consortium is working towards establishing a universal market for chiplets, similar to the existing soft design IP market [4][5] Group 3: Implementation and Adoption Challenges - The implementation of UCIe features may face challenges due to the need for consensus among various stakeholders, which can slow down the adoption of new functionalities [17][18] - Companies may choose to use proprietary interfaces for chiplets that are not intended for sale, while others will look to adopt industry standards for commercial products [18][19] - The complexity of UCIe features may deter some companies from fully utilizing the standard, as many prefer simpler, more lightweight solutions [15][16]