D2D，怎么连？

Core Viewpoint - UCIe 2.0 introduces optional features that can be customized based on specific design needs, addressing concerns about its complexity and "weight" in advanced packaging interconnect standards [1][2][3] Summary by Sections UCIe 2.0 Features - UCIe 2.0 offers a range of optional features that can be tailored to various applications, from automotive to high-performance computing [2] - The standard allows for flexibility similar to PCIe, CXL, and NVMe, enabling users to implement only the necessary functions [2][5] Market Outlook - Current advanced packaging products are primarily developed by financially robust companies that control all components, enhancing their ability to manage chip interactions [4] - The vision for the future includes establishing a universal market for chiplets, with many customers expressing a desire to be part of an ecosystem [4] Management Functions - UCIe 2.0 includes management functions that ensure startup and composability, which are optional and can enhance communication between chiplets [7][9] - Key management functions include chip discovery, configuration, firmware download, power management, error reporting, and performance monitoring [7] Discovery Technology - Discovery technology is crucial for confirming chiplet communication and is designed to be efficient, allowing for quick register reads to verify connections [10][11] - The concept of dynamic discovery is less relevant for advanced packaging, where static discovery suffices for confirming chiplet contents [10][11] Competitive Landscape - UCIe and BoW are in a competitive landscape, with both standards having their proponents and unique advantages [20][21] - UCIe's optional features may help it achieve a lighter design compared to BoW, which is often perceived as more lightweight due to its simpler implementation [20][21] Industry Perspectives - Companies are cautious about fully committing to either standard, as proprietary designs continue to play a significant role in the market [21] - The industry is observing how both standards evolve and which features will prove most beneficial in practical applications [21]