国产5nm芯片怎来的?

Core Viewpoint - The article discusses the current state and future prospects of semiconductor manufacturing, particularly focusing on the challenges and methodologies involved in producing advanced nodes like 5nm and 3nm without EUV lithography. It emphasizes the importance of transistor density as a key metric for evaluating semiconductor technology advancements. Group 1: Semiconductor Manufacturing Techniques - DUV lithography combined with multiple exposure techniques can theoretically produce 5nm chips, and even 3nm under extreme conditions, although this approach is costly and not commonly adopted by mainstream foundries [5][23][48]. - The concept of "5nm" has evolved from a direct measurement of line width to a symbolic representation of a process node, with actual transistor gate lengths often exceeding the nominal node size [6][12][23]. Group 2: Transistor Density and Performance - Transistor density (MTr/mm²) is a more relevant metric than line width for comparing semiconductor technologies, as it reflects the number of transistors that can fit in a given area [13][21]. - The article provides a comparative analysis of transistor densities across various nodes, highlighting that the upcoming domestic 5nm technology may only achieve densities comparable to optimized 7nm processes [14][49]. Group 3: Industry Competition and Challenges - The competition among major players like TSMC, Intel, and Samsung is intense, with each company defining process nodes differently, leading to discrepancies in reported capabilities [21][22]. - The article points out that while Samsung claims to have achieved 5nm production, its actual transistor density and yield rates are significantly lower than those of TSMC, raising questions about the validity of such claims [15][21]. Group 4: Future Prospects and Technological Innovations - The semiconductor industry is expected to continue advancing, with predictions of achieving one trillion transistors on a single GPU chip within the next decade, driven by innovations beyond traditional lithography [19][48]. - The article stresses the need for domestic semiconductor manufacturers to focus on improving deposition and etching equipment, as these are critical for achieving high yields and performance in advanced nodes [48][50].