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玻璃基板,三星将上马
半导体行业观察·2025-05-26 00:50

Core Viewpoint - Samsung Electronics plans to introduce glass substrates into semiconductor manufacturing by 2028, aiming to meet the growing demand for advanced semiconductors driven by artificial intelligence (AI) [1][2]. Group 1: Introduction of Glass Substrates - Samsung has confirmed its roadmap to replace silicon interposers with glass interposers in advanced semiconductor packaging by 2028, marking a significant shift in technology [1]. - The glass interposer is expected to enhance semiconductor performance and reduce production costs due to its ability to facilitate ultra-fine circuits [1][2]. Group 2: Industry Response and Competitors - The industry is moving towards glass interposers faster than glass substrates, with AMD also planning to implement glass interposers by 2028 [2]. - Samsung's initiative is seen as a response to the increasing demand for AI-driven advanced semiconductors, as the company engages in foundry services based on customer orders [2]. Group 3: Production and Implementation Strategy - Samsung is negotiating with supply chain companies to use glass interposers customized for chip sizes, rather than standard glass substrates [2]. - The initial size of glass substrates is 510×515mm, which will be cut to fit chip dimensions, while Samsung is focusing on glass sizes below 100×100mm to expedite technology implementation and prototype production [2]. Group 4: Packaging and Integration Strategy - Samsung plans to integrate glass interposers with semiconductor packaging at its Tianan Park facility, utilizing established panel-level packaging (PLP) production lines [3]. - The introduction of glass interposers is expected to strengthen Samsung's "AI integrated solutions" strategy, enhancing its competitiveness in foundry and packaging services [3].