高端车规芯片企业「创晟」完成新融资，规模近亿元｜早起看早期

Core Viewpoint - The article discusses the recent funding round of Chuangsheng Semiconductor, a high-end automotive communication chip company, highlighting its innovative products and market potential in the automotive audio bus sector [4]. Company Overview - Chuangsheng Semiconductor, established in 2023, focuses on mid-to-high-end automotive communication chips. The core team has over 20 years of experience from leading semiconductor companies like TI and ADI [4]. - The company has launched the MBUS1.0 series, a leading automotive audio communication chip, which breaks the long-standing foreign monopoly in this field. The product features low latency, high bandwidth, and good EMC/EMI performance, with mass production expected by July 2025 [4]. Market Trends - The automotive E/E architecture is evolving from distributed to centralized systems, leading to increased demand for high-bandwidth, low-wiring audio buses. The number of audio nodes in vehicles has grown from 2 in 2014 to an average of over 6, with potential for 8 or more nodes due to advancements in RNC algorithms [5]. - The design and layout of automotive audio buses face challenges such as increased data transmission volume, higher bandwidth requirements, and complex wiring issues [5]. Challenges and Innovations - The chairman of Chuangsheng Semiconductor, Sophia, noted that the use of UTP (unshielded twisted pair) in automotive audio buses presents EMC design challenges, requiring extensive experience in high-speed analog interface design and automotive EMC systems [6]. - The company is developing the MBUS1.0plus series to meet the demands of the next-generation E/E architecture, aiming to overcome transmission speed and node capacity limitations [6]. Strategic Partnerships - Strategic investors, including Ruisheng Technology and Xunfei Venture Capital, express confidence in Chuangsheng's market entry opportunities and the team's rich experience in high-speed interface chip design [6]. - Partnerships aim to enhance the integration of hardware, algorithms, and chip technologies, contributing to the development of advanced automotive audio solutions [6].