封装巨头抢攻FOPLP市场

Core Viewpoint - The article discusses the advancements and future potential of Fan-Out Panel Level Packaging (FOPLP) technology in the semiconductor industry, highlighting the strategic moves by major players like ASE Technology and Powertech Technology to enhance their operational contributions starting next year [4][6]. Group 1: Industry Trends - The global semiconductor industry is experiencing growth driven by emerging applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, which are pushing advanced packaging technologies to the forefront [4]. - FOPLP technology is gaining traction due to its high efficiency, low cost, and high yield, making it a key solution for next-generation packaging [4]. Group 2: Company Developments - ASE Technology has been developing FOPLP for over ten years and plans to begin trial production by the end of this year, with a gradual increase in operational contributions starting next year [4]. - Powertech Technology has already started small-scale shipments of FOPLP and is validating high-end products for significant clients, indicating a positive outlook for future operational contributions [6]. Group 3: Technical Specifications - ASE Technology has progressed from a 300x300mm specification to a 600x600mm specification for FOPLP, with expectations that if the yield meets projections, it will become the mainstream specification [5]. - Powertech Technology has developed a packaging solution for a high-end system-on-chip (SoC) using a 2nm process, with a total packaging cost reaching $25,000, showcasing the high value of advanced packaging designs [6].