先进封装，成为主角

Core Insights - Advanced packaging is transitioning from a "non-mainstream Plan B" to a "mainstream Plan A" in the semiconductor industry, driven by three key forces [1][4][7] Group 1: Key Forces Driving Advanced Packaging - The first force is the explosion of computing power, while process advancements are slowing down, necessitating chip cutting, stacking, and reorganization. Chiplets are seen as a solution to overcome limitations in chip area [1][2] - The second force is the diversification of applications, moving away from a single-chip solution to modular system designs. Advanced packaging combined with chiplets offers a balance of design flexibility and efficiency [1][2] - The third force is the rising cost of data transportation, where energy consumption for data movement often exceeds that of computation. Advanced packaging addresses this by reducing the distance data needs to travel, enhancing overall efficiency [2] Group 2: Market Growth and Investment - The advanced packaging industry is projected to achieve a compound annual growth rate (CAGR) of 12.9% over the next six years, with revenues expected to grow from $39.2 billion in 2023 to $81.1 billion by 2029 [4] - Major players in the industry, including TSMC, Intel, and Samsung, are significantly investing in advanced packaging capabilities, with an estimated $11.5 billion investment planned for 2024 [4][7] - Despite a seasonal decline in Q1 2024, advanced packaging revenue is expected to rebound in Q2 2024, reaching $10.7 billion, indicating resilience in the market [4][7]