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台积电2纳米制程投产在即,代工价格飙升至3万美元;全球最轻大折叠vivo X Fold5定档6月下旬发布丨智能制造日报
TSMCTSMC(US:TSM) 创业邦·2025-06-04 03:31

Group 1 - TSMC is set to begin production of its 2nm process, with total costs reaching $725 million and wafer foundry prices soaring to $30,000 per wafer. The upcoming 1.4nm process is expected to cost $45,000 per wafer [1] - Vivo's new foldable smartphone, the X Fold5, is scheduled for release in late June, aiming to surpass its predecessor's weight record of 219g and become the world's first foldable phone with full waterproofing [1] - The global smartphone market has seen a decline in growth for three consecutive quarters, with Q1 2025 showing only a 0.2% increase in shipments, totaling 296.9 million units. Samsung leads with 60.5 million units shipped, followed by Apple with 55 million and Xiaomi with 41.8 million [1] Group 2 - Zhikong Jiyuan Robotics has launched a series of coating robots designed for "three high materials" (high viscosity, high curing speed, high adhesion). These robots can enhance construction efficiency by 300%, reduce material waste by over 25%, and minimize high-risk operations by 90% [1]