PCIe 7.0正式发布，光纤规范同步亮相，启动PCIe 8.0预研

Core Viewpoint - PCI-SIG has officially released the PCI Express (PCIe) 7.0 specification, achieving a speed of 128.0 GT/s, aimed at data-driven applications such as AI/ML, 800G Ethernet, cloud computing, and quantum computing [1][4]. PCIe 7.0 Specification Features - PCIe 7.0 offers a raw bit rate of 128.0 GT/s and a bidirectional rate of up to 512 GB/s through an x16 configuration [4][8]. - It utilizes PAM4 signaling and Flit-based encoding, enhancing power efficiency while maintaining backward compatibility with previous PCIe generations [4][8]. Industry Context and Future Developments - The release of PCIe 7.0 continues the tradition of doubling I/O bandwidth every three years, addressing the bandwidth demands of data-intensive markets, including AI and HPC [4][15]. - PCIe 8.0 exploration is already underway to support ongoing industry investments and product roadmaps [1]. Market Demand and Applications - The demand for PCIe technology is driven by the rapid expansion of AI applications, with modern AI workloads requiring architectures that integrate multiple accelerators [13][15]. - PCIe 7.0 is expected to be deployed in data centers, enhancing connectivity between accelerators, processors, NICs, and other components with low latency and low power consumption [15]. Energy Efficiency and Advanced Features - Despite performance improvements, PCIe 7.0 aims to maintain or enhance energy efficiency, crucial for reducing operational costs and environmental impact in data centers [16]. - New features include improved channel margin capabilities, enhanced error detection, and support for emerging technologies like CXL [16]. Optical Interconnect Solutions - PCI-SIG has introduced a new optical interconnect specification revision to enhance PCIe technology performance, marking the industry's first standardized approach for optical solutions [10][19]. - The transition to optical solutions is expected to expand the physical coverage of computing networks, offering lower latency and improved thermal management capabilities [19][20].