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美国人不让建封装厂,特朗普芯片计划陷入困境
半导体行业观察·2025-06-12 00:41

Core Viewpoint - The article discusses the delays and challenges faced by semiconductor manufacturing projects in the U.S. due to local opposition and regulatory hurdles, particularly highlighting the impact of the CHIPS Act and geopolitical tensions in the semiconductor industry [1][5][6]. Group 1: Project Delays and Local Opposition - Amkor's $2 billion advanced packaging plant in Peoria, Arizona, faces local resistance due to concerns over water resources and traffic congestion, with residents threatening legal action [2]. - Micron's $100 billion DRAM production facility in Clay, New York, has encountered delays in environmental assessments and public feedback, pushing back the construction timeline originally set for 2024 [3][4]. - The delays in Micron's project could result in a loss of $5 million per day, affecting its ability to meet production goals for DRAM in the late 2020s [3]. Group 2: Importance of Semiconductor Manufacturing - The advanced packaging plant by Amkor is crucial for the local semiconductor supply chain, which includes TSMC's Fab 21 and multiple suppliers, and is expected to be one of the largest in the world [2]. - Micron's facility is intended to be its largest manufacturing base and a key part of its strategy to increase U.S. production of DRAM, aiming for 40% of its output to be produced domestically by the mid-2030s [4]. Group 3: Geopolitical Context and Industry Dynamics - The semiconductor trade, valued at $600 billion, has become a focal point in discussions about global security and economic dominance, particularly between the U.S. and China [5]. - The CHIPS Act aims to bolster U.S. semiconductor manufacturing and reduce reliance on Taiwan, which currently produces about 90% of the world's advanced semiconductors [6][7]. - The article highlights the contrasting strategies of the Biden and Trump administrations regarding semiconductor policy, with Biden focusing on investment incentives and Trump emphasizing tariffs [7][8].