研究表明：HBM将在决定AI性能方面超越GPU
半导体芯闻·2025-06-12 10:04
如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自 koreajoongangdaily 。 | | | | | FAAAAT | | --- | --- | --- | --- | --- | | HBM4 (2026) | HBM5 (2029) | HBM6 (2032) | HBM7 (2035) | HBM8 (2038) | | Data Rate 8 Gbps | 8 Gbps | 16 Gbps | 24 Gbps | 32 Gbps | | # of IVO 2,048 | 4.096 | 4.096 | 8,192 | 16,384 | | Bandwidth 2.0 TB/s | 4 TB/s | 8 TB/s | 24 TB/s | 64 TB/s | | Capacity/die 24 Gb | 40 Gb | 48 Gb | 64 Gb | 80 GP | | # of die stack 12/16-Hi | 16-Hi | 16/20-Hi | 20/24-Hi | 20/24-Hi | | Capacity 36/48 GB /HBM | 80 GB | 96/120 ...