ASML的尴尬

Core Viewpoint - TSMC's decision to limit the purchase of ASML's new High-NA EUV lithography machines indicates a significant shift in the semiconductor industry, reflecting a broader trend of changing power dynamics and technological advancements that reduce reliance on high-cost equipment [1][2]. Group 1: TSMC's Position on High-NA EUV Machines - TSMC has only symbolically purchased one unit of ASML's new High-NA EUV lithography machine, which has sold only five units globally, indicating a lack of demand [1]. - TSMC executives stated that the 1.4nm chip process does not require High-NA EUV technology, as significant performance improvements have already been achieved without it [1][2]. - The high price of the High-NA EUV machine, at $400 million (approximately 3 billion RMB), is a major factor in TSMC's decision to delay its adoption [2]. Group 2: Industry Dynamics and Technological Advancements - The semiconductor industry is undergoing a major restructuring, with a consensus among international media that the era of high-price monopolies maintained by Western companies is ending [2]. - Chinese companies have made significant technological breakthroughs in areas such as 7nm chip manufacturing and SiC power devices, prompting foreign companies to reduce prices by 30% by 2025 to remain competitive [2]. - TSMC's technology team has achieved notable advancements, extending the lifespan of EUV lithography machines and improving the 1.4nm process performance by 15% or reducing power consumption by 25%-30% at the same frequency [2]. Group 3: EUV Lithography Technology Overview - ASML's EUV lithography machines are essential for manufacturing chips below 7nm, with ASML being the sole producer of these machines globally [2][4]. - The transition from Low NA EUV machines (0.33 NA) to High NA EUV machines (0.55 NA) is crucial for processes below 3nm, as the latter offers higher resolution and lower power consumption [3]. - ASML's EUV machines support advanced process nodes of 5nm and below, with a registration accuracy of ≤1.5nm, while domestic lithography machines lag behind in capabilities [4].