Core Viewpoint - Huawei has applied for a "quad-chiplet" packaging design patent, potentially for next-generation AI chips, which may allow it to compete with TSMC and NVIDIA in the AI GPU market [2][4]. Group 1: Patent and Technology Development - The "quad-chiplet" design is similar to NVIDIA's Rubin Ultra architecture, but Huawei appears to be developing its own advanced packaging technology [4]. - The patent indicates a bridging technology, akin to TSMC's CoWoS-L, rather than a simple intermediate layer [4]. - To meet the demands of AI training processors, the chips are expected to be paired with multiple HBM (High Bandwidth Memory) through interconnections [4]. Group 2: Competitive Positioning - Although Huawei currently lags in advanced process technology by one generation, its advanced packaging capabilities may be on par with TSMC [4]. - This advancement allows Chinese manufacturers to use mature process technologies to produce multiple chips, which can then be integrated through packaging to enhance performance, potentially narrowing the gap with advanced process chips [4]. - Ren Zhengfei, Huawei's founder, has stated that concerns over chip technology are unwarranted, suggesting that methods like stacking and clustering can yield results comparable to the most advanced levels [4].
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