Workflow
申万宏源助力华夏银行股份有限公司2025年科技创新债券(第一期)成功发行

Core Viewpoint - The successful issuance of the "Hua Xia Bank Co., Ltd. 2025 Technology Innovation Bond (Phase I)" signifies a strategic move towards enhancing financial services in the technology innovation sector, with a focus on supporting small and medium-sized enterprises and high-tech companies [1] Group 1 - The bond issuance scale is 10 billion yuan, with a term of 5 years and a coupon rate of 1.78%, marking the lowest coupon rate for Hua Xia Bank's financial bonds [1] - This bond is the largest 5-year commercial bank technology innovation bond currently in the market, reflecting the growing emphasis on technology finance [1] - The issuance supports the bank's strategy to strengthen financial services for technology-driven enterprises, contributing to high-quality development of the real economy [1] Group 2 - The bond represents the first collaboration between the company and the issuer, which has been highly recognized by the issuer, solidifying the partnership and enhancing the company's influence in the technology innovation bond sector [1] - The company aims to continue implementing national development strategies and fulfill its mission as a financial central enterprise [1]