高功率DC-DC应用设计新方案:DFN3.3x3.3源极朝下封装技术
AOSAOS(US:AOSL) 半导体芯闻·2025-06-18 10:09

Core Viewpoint - Alpha and Omega Semiconductor Limited (AOS) has launched the AONK40202 25V MOSFET, designed for high power density applications, particularly in AI servers and data center power systems, utilizing innovative Source Down packaging technology to enhance thermal and electrical performance [2][3]. Group 1: Product Features - The AONK40202 MOSFET features a DFN3.3x3.3 Source Down packaging, which simplifies PCB layout and optimizes heat dissipation and electrical performance [2][3]. - This MOSFET can handle a continuous current of up to 319A and operates at a maximum junction temperature of 175°C, significantly improving system-level performance and power density [2]. - Compared to traditional Drain Down packaging, the Source Down design reduces power loss and enhances thermal performance, providing engineers with key advantages in optimizing PCB space utilization [3]. Group 2: Company Overview - AOS specializes in the design, development, production, and global sales of power semiconductors, including Power MOSFETs, SiC, IGBTs, and power ICs [4]. - The company has accumulated extensive intellectual property and technical expertise, enabling it to launch innovative products that meet the complex power demands of advanced electronic devices [4]. - AOS's product portfolio targets high-demand applications such as portable computers, graphics cards, data centers, AI servers, smartphones, and various power supply needs across consumer and industrial sectors [4].