黑芝麻智能拟收购AI芯片企业

Core Viewpoint - Black Sesame Intelligence International Holdings Limited (stock code: 2533.HK) plans to acquire an AI chip company through equity acquisition and capital injection, focusing on high-performance, low-power AI system-on-chip (SoC) solutions [1] Group 1 - The target company specializes in the development and sales of AI SoC solutions, with a significant portion of its intellectual property (IP) being self-developed, including image signal processors (ISP), neural network processors (NPU), and analog IP [1] - The acquisition aims to expand Black Sesame's product line across high, medium, and low-end computing chips, enhancing its capabilities in providing comprehensive solutions for smart vehicles and robots [1] - Black Sesame has established partnerships with several automotive companies, such as Geely, Dongfeng, and BYD, and is accelerating its expansion into the robotics chip market [1] Group 2 - The target company is expected to meet specific criteria, including a high self-research rate of core IP, achieving high-performance AI inference within a power range of 20W-50W, and obtaining AEC-Q100 Grade 1 certification [2] - It should occupy a technological advantage in areas like autonomous driving perception and have technical reserves for robotics and industrial automation applications [2] - The company should have experience in advanced process manufacturing below 7nm and stable foundry resources, with its toolchain and algorithm library compatible with Black Sesame's existing platform [2]