贝塔投资智库·2025-06-19 04:00Core Viewpoint - The rise of artificial intelligence (AI) presents new development opportunities for Co-Packaged Optics (CPO) technology and related companies, addressing challenges in bandwidth, power consumption, and cost [1][2]. Group 1: CPO Technology Overview - CPO is an advanced technology that integrates optical devices with silicon chips on the same packaging substrate, aimed at overcoming challenges faced by the next generation of technology [1]. - Analysts have noted that while CPO has significant potential advantages, high technical barriers and limited market demand have previously hindered its commercialization [1]. Group 2: Market Dynamics and Growth Projections - The industry’s attitude towards CPO has shifted due to the development of AI and related infrastructure, highlighting the limitations of existing technologies in balancing high data rates and power consumption [1][2]. - Analysts predict that the CPO market will begin to grow significantly in 2027, with a market size exceeding $1 billion by 2028 and surpassing $5 billion by 2030 [2]. Group 3: Challenges and Industry Transition - Despite its advantages, CPO faces challenges in areas such as thermal management, reliability, and maintainability [2]. - Continuous advancements in these areas, along with concerns about the physical limits of traditional solutions, are driving the industry towards CPO adoption [2]. Group 4: Beneficiary Companies - Companies expected to benefit from CPO include Broadcom (AVGO.US), Coherent (COHR.US), Corning (GLW.US), Fabrinet (FN.US), Lumentum (LITE.US), Marvell Technology (MRVL.US), NVIDIA (NVDA.US), TSMC (TSM.US), UMC (UMC.US), Cisco (CSCO.US), and Advantest (ATEYY.US) [3].