申万宏源证券上海北京西路营业部·2025-06-19 02:18Core Viewpoint - The successful issuance of the "Hua Xia Bank Co., Ltd. 2025 Technology Innovation Bond (Phase I)" with a scale of 10 billion yuan and a coupon rate of 1.78% marks a significant achievement in the market for commercial bank technology innovation bonds, reflecting the bank's commitment to supporting technological innovation and the real economy [1]. Group 1 - The bond issuance is the largest 5-year commercial bank technology innovation bond in the market [1]. - The bond has a term of 5 years and a coupon rate of 1.78%, which is the lowest for Hua Xia Bank's financial bonds [1]. - The issuance supports the bank's strategy to enhance financial services in the technology innovation sector, particularly for small and medium-sized enterprises and high-tech companies [1]. Group 2 - The successful issuance strengthens the partnership between the issuer and the underwriter, Shenwan Hongyuan Securities, enhancing the latter's influence in the technology innovation bond sector [1]. - The company aims to continue implementing national development strategies and fulfill its mission as a financial central enterprise [1].