台积电，再创新高

Core Viewpoint - The article highlights TSMC's (Taiwan Semiconductor Manufacturing Company) significant market share increase in the global semiconductor foundry sector, reaching 35% in Q1 2024, driven by strong demand for AI and high-performance computing (HPC) chips [1][2]. Group 1: Market Performance - TSMC's revenue in the global semiconductor foundry market is projected to grow by 13% year-over-year, reaching $72 billion in Q1 2025, primarily due to the rising demand for AI and HPC chips [1]. - The overall semiconductor foundry market is expected to benefit from advanced process technologies such as 3nm and 4nm, as well as advanced packaging techniques [1]. - The OSAT (Outsourced Semiconductor Assembly and Test) industry is experiencing moderate growth, with a revenue increase of approximately 7%, benefiting from TSMC's AI chip orders [1]. Group 2: Competitive Landscape - TSMC's market share increase to 35% significantly outpaces the overall industry growth, solidifying its leading position in the market [2]. - In contrast, non-memory IDM (Integrated Device Manufacturer) companies like NXP, Infineon, and Renesas are facing a revenue decline of 3% due to weak demand in automotive and industrial applications [2]. - Intel has made some progress with its 18A/Foveros technology, while Samsung continues to face yield challenges in its 3nm GAA development [2]. Group 3: Future Outlook - AI is identified as the core driver of growth in the semiconductor industry, reshaping the priorities within the foundry supply chain and reinforcing TSMC's critical role alongside advanced packaging suppliers [3]. - The foundry industry is expected to transition from a traditional linear manufacturing model to a highly integrated value chain system, termed "Foundry 2.0" [3]. - The proliferation of AI applications, maturity of Chiplet integration technology, and deepening of system-level collaborative design are anticipated to lead to a new wave of semiconductor technological innovation [3].