HBM关键设备，韩国对中出口

Core Viewpoint - Hanmi Semiconductor has begun supplying thermal compression bonding machines (TC Bonder) to Chinese semiconductor companies, marking a shift from its previous exclusive supply to SK Hynix, indicating a response to SK Hynix's diversification strategy [1][2]. Group 1: Supply Chain Dynamics - Hanmi Semiconductor's move to supply Chinese firms is seen as a reaction to SK Hynix accelerating its supply chain diversification, having started to procure bonding machines from Hanwha Semitech since June last year [1]. - The scale of supply to Chinese companies is currently small, with concerns about potential technology leakage, particularly regarding Hanmi's proprietary technologies [2]. Group 2: Market and Regulatory Risks - The U.S. government has increased export controls on semiconductor technology to China, which poses a risk for companies exporting semiconductor equipment, including Hanmi Semiconductor [2]. - Although thermal compression bonding machines are not currently on the U.S. export ban list, there is a possibility of increased scrutiny if the U.S. perceives these machines as aiding China's advancement in high-bandwidth memory (HBM) technology [2].