Core Viewpoint - The company is optimistic about its operations in the second half of the year, driven by the demand for advanced packaging due to the AI application boom, projecting a 10% year-on-year increase in advanced process packaging revenue for the year [1]. Group 1: Company Operations - The company plans to invest $200 million in large-size fan-out panel packaging (FOPLP) and has already begun equipment installation in the second quarter, with shipments expected by the end of the year [1]. - Advanced packaging and testing revenue is projected to reach $600 million in 2024, accounting for approximately 6% of total packaging revenue, with an additional increase of over $1 billion expected this year [1]. - The company is actively planning a testing facility in the U.S. to meet the complex packaging needs of AI chips, responding to the expansion of clients like NVIDIA [1]. Group 2: Industry Outlook - The semiconductor industry is expected to reach a global market value of $1 trillion by 2030, with the company expressing confidence that this target will be met, even if slightly delayed [2]. - AI is anticipated to drive significant changes in data centers, cloud infrastructure, and robotics, with the company emphasizing the need for Taiwan to enhance its peripheral technologies to capitalize on the upcoming AI robotics market [2].
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半导体芯闻·2025-06-25 10:24