芯片，最新路线图

Core Viewpoint - IMEC's semiconductor roadmap predicts the evolution of chip manufacturing processes and technologies until 2039, highlighting significant advancements and challenges in the semiconductor industry [1][3]. Group 1: Chip Process Node Naming and Evolution - Current chip process nodes like 7nm, 5nm, and 3nm have become mainstream, but these numbers no longer correspond to physical dimensions, evolving into a conventional naming convention [6][9]. - The transition from planar transistors to FinFET architecture has shifted the focus from size reduction to architectural innovation and density optimization for performance improvements [7][10]. - The roadmap indicates a shift from FinFET to NanoSheet architecture as the industry moves towards the N2 process node, with NanoSheet offering better control over leakage currents and improved performance [20][21]. Group 2: Advanced Technologies and Innovations - High NA EUV lithography technology is transitioning from 0.33 NA to 0.55 NA, enabling the production of chips with smaller feature sizes and supporting the NanoSheet architecture [27][29]. - Back-side power technology is introduced to reduce crosstalk and improve data integrity, expected to enhance performance by reducing power consumption by 30% while increasing computational speed by 20% at the A10 node [34][35]. - ForkSheet transistors are emerging as a strong candidate for 1nm technology nodes, allowing for higher integration density and improved performance through a unique gate structure [36][40]. Group 3: Future Directions and Challenges - CFET technology is anticipated to dominate the semiconductor landscape, with its introduction expected around the A7 node, promising significant density and performance improvements [41][43]. - Hyper NA EUV technology is being developed to meet the extreme precision requirements of CFET manufacturing, pushing the limits of semiconductor fabrication [46][48]. - 2DFET technology, utilizing two-dimensional materials, is projected to replace CFET by 2039, offering simplified manufacturing processes and enhanced performance [52][54].