傅里叶的猫·2025-06-29 10:24Core Viewpoint - The article provides an analysis of TSMC's CoWoS and WMCM technologies, focusing on customer demand, capacity forecasts, and investment outlooks, particularly in the semiconductor industry [1]. Customer Demand Analysis - For NVIDIA, JP Morgan forecasts a 25% increase in CoWoS demand by 2026, reaching 58% market share, driven by the migration to the Rubin platform, which will increase package size by 50% [2]. - AMD's CoWoS demand is expected to be weak in 2025 and 2026 due to restrictions on the MI300 series in the Chinese market, but there is optimism for the MI400 series in late 2026 and 2027 [3]. - Broadcom is projected to see stable growth in ASIC demand, particularly from Google TPU, with Meta expected to start mass production of its CoWoS-based AI accelerator in 2025 [4][5]. Capacity and Technology Analysis - TSMC's CoWoS capacity is expected to stabilize by 2027, with a slight slowdown in expansion plans due to reduced GPU demand in China [10]. - By 2026, CoWoS-L is anticipated to account for 64% of TSMC's total CoWoS output, driven by more customers migrating to this technology [13]. - WMCM technology is simpler than CoWoS and is expected to significantly expand, with production capacity projected to reach 27,000 wafers per month by the end of 2026 and 40,000 by the end of 2027 [15]. Overall Consumption Forecast - Total CoWoS consumption is projected to grow from 134,000 wafers in 2023 to 1,132,000 wafers by 2027, reflecting a compound annual growth rate of 32% [11]. - NVIDIA's CoWoS consumption is expected to increase significantly, with projections of 705,000 wafers by 2027, while AMD's consumption will remain modest [11]. - The overall market for CoWoS is expected to see a shift towards CoWoS-L, with a majority of customers adopting this technology by 2025 [11][12].