Core Viewpoint - Samsung Electronics is set to supply 12-layer HBM3E to Broadcom, with plans for mass production starting as early as the second half of this year to next year, aiming to mitigate the impact of NVIDIA's HBM supply delays [1][3]. Group 1: Supply Agreements - Samsung has completed quality testing for HBM3E 12-layer with Broadcom and is negotiating supply volumes estimated between 12 billion to 14 billion Gb, with mass production expected soon [1]. - Samsung is also in active discussions to supply HBM3E 12-layer memory to Amazon Web Services (AWS), which plans to produce the next generation AI semiconductor "Trainium 3" using this memory [2]. Group 2: Market Dynamics - The surge in development of proprietary ASICs by major tech companies presents an opportunity for Samsung to offset the downturn in its HBM business [3]. - Samsung's initial plan to supply NVIDIA with HBM3E 12-layer was delayed due to performance issues, and the company is now adjusting its production rates for HBM3E lines [3]. Group 3: Production Goals - Samsung aims to double its total HBM supply to between 8 billion to 9 billion GB this year, compared to last year [1]. - The successful supply to NVIDIA and acquisition of more ASIC clients in the second half of this year is crucial for stabilizing Samsung's HBM business [3].
三星HBM,正式拿下大客户
半导体芯闻·2025-07-03 10:02