联电要布局6nm先进封装？

Core Viewpoint - United Microelectronics Corporation (UMC) reported a consolidated revenue of NT$18.823 billion for June, showing a month-over-month decline for the second consecutive month, but a slight growth of 1.55% quarter-over-quarter, aligning with the company's expectations [1] Group 1: Revenue Performance - UMC's June consolidated revenue was NT$18.823 billion, reflecting a month-over-month decrease of 3.37% and a year-over-year growth of 7.26% [1] - For the second quarter, UMC's consolidated revenue reached NT$58.758 billion, which is a slight increase of 1.55% compared to the previous quarter and a 3.45% increase year-over-year [1] - Cumulatively, UMC's revenue for the first half of the year was NT$116.617 billion, marking a year-over-year growth of 4.65% [1] Group 2: Market Strategy and Future Plans - Due to the oversupply in the mature process market driven by increased capacity from Chinese manufacturers, UMC is considering a gradual shift towards advanced processes to enhance long-term competitiveness [2] - Reports suggest that UMC is contemplating expanding its partnership with Intel, potentially moving from a 12nm process to a 6nm process, although UMC has refrained from commenting on market speculation [2] - UMC plans to diversify its expansion beyond traditional wafer manufacturing to include advanced packaging and other high-value areas, with ongoing investments in 2.5D packaging processes in Singapore [2] - The company aims to develop a comprehensive advanced packaging solution rather than focusing solely on process technology, integrating wafer foundry services with packaging to create a complete service system [2]