【首日精彩】百家企业齐聚合肥，共探光刻产业未来发展新机遇 | 2025势银（第五届）光刻产业大会（PRIC 2025）

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference held on July 9 in Hefei focused on advanced lithography technologies and the current state of domestic lithography materials, discussing the need for technological innovation and industrial upgrades to enhance self-sufficiency and quality in the domestic market [1][15]. Group 1: Conference Highlights - The conference covered cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint lithography, along with the analysis of domestic lithography materials like photoresists and wet electronic chemicals [1][2]. - Key discussions included the challenges and solutions in the localization of lithography equipment, focusing on equipment R&D, manufacturing processes, performance improvements, and market conditions [2]. Group 2: Expert Insights - Wang Chengqian emphasized the importance of developing next-generation AI as a strategic resource for gaining a competitive edge in global technology [19]. - Luo Feng highlighted the advantages of physical deposition dry photoresists in HNA-EUV technology, including lower dose requirements and better uniformity [21]. - Zhang Wali discussed the benefits of hybrid bonding technology, which allows for smaller pitch and higher I/O density [23]. - Li Zili introduced directed self-assembly (DSA) techniques for contact hole miniaturization, meeting sub-10nm process node requirements [25]. - Sun Fengxia pointed out the challenges in domestic photoresist localization, including technology monopolies and high entry costs [31]. - 应颖 noted the growth in the display and semiconductor photoresist market, driven by government policies and industry chain development [33]. Group 3: Specialized Forums - The forum on photoresists and wet electronic chemicals featured discussions on trends in packaging technology and the need for environmentally friendly solutions [36]. - SAM SUN explained the challenges in the CAR theory related to photoresist performance and defect management [38]. - Du Mengcheng discussed the technical difficulties in developing PSPI for chip interconnections [40]. - Huang Xinyi emphasized the need to enhance photoresist performance and supply chain resilience to meet ESG goals [48]. - The roundtable featured discussions on various topics related to micro-nano platform processes and industry challenges [50].