"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 添加文末微信，加 异质异构集成产业 群 势银（ TrendBank）观察到，受到台积电InFO系列、CoWoS-R产品规模化订单驱动，先进封装产业界 对Fan out晶圆重构技术和市场未来发展潜力预期很高，都纷纷开发FOWLP、FOPLP技术，来尽快满足 市场需求，抢得产业先机。 但是，产业的发展需要循序渐进，全球高阶FO产品品类、需求有限（HD FO/UHD FO），高价值量订单 （例如计算芯片、通信芯片、网络芯片等晶圆）基本被国际龙头企业所承接。 无论在晶圆级还是面板级扇出封装领域，中国本土先进封装企业都已具备较强的技术竞争力，但奈何本土 高附加值晶圆的FO订单需求有限，玩家却如雨后春顺般增长。 所以产业需往体量大/应用面广的FO晶圆产品方向开拓，例如分立器件、功率芯片/模组、音频/射频/雷 达模块等对晶圆重构封装要求不高、附加值相对较低的领域，以保证产线正常运转、积累FO封装经验及 案例，这将成为国内企业发展高阶FO技术的必经之路。 根据 势银（ TrendBank）推算，2025年中国本土扇出型封装市场规模突破1亿美元 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 添加文末微信，加 异质异构集成产业 群 在 AI 算力需求 的急速爆增下，光模块尤其是 800G 光模块已 逐渐 成为 AI 数据中心的主流 配置 。 据相关数据预测， 2024年全球 800G 模块出货量约 800 万只 ， 而 2025年预计 增 至 2000 万只 左右 ， 1.6T 模块 也将 从 2024年的270万只增至2025年的420万只 ， 全球 光模块市场规模将达 235 亿美元 。 而 光芯片 ， 作为光模块 中 实现高速、低延迟数据传输的核心器件， 被称为光模块的 "心 脏"， 其市场规模 也 随着光模块需求增长而 " 水涨船高 " 。 据 预计到 2030 年，全球光芯 片市场规模将超过 110 亿美元，年复合增长率达 20% 以上。 但中国 25G 以上高速光芯片国 产化率仍处于较低水平，因此整体市场存在巨大替代空间。 从技术路线来看，目前 光芯片主要采用 EML、VCSEL 等技术路线 —— EML ：高速电吸收调制激光器（EML）融合了分布反馈（DFB）激光器和电吸收调制器 （EA）的功能，其中 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 添加文末微信，加 异质异构集成产业 群 近日，ICCAD-Expo 2025 在成都中国西部国际博览城顺利举办，硅芯科技创始人兼首席科 学家赵毅博士受邀出席高峰论坛，并正式对外发布 "2.5D/3D EDA⁺新范式，重构先进封装 全流程设计、仿真与验证的协同创新"。系统阐述如何将先进封装工艺、 Chiplet互联、多芯 粒系统与EDA工程体系重新整合为一个可闭环的协同框架。 先进封装时代： EDA⁺新范式重构设计逻辑 赵毅博士指出，随着 AI、智能汽车、高带宽存储等应用推动算力需求攀升，先进封装已经从 后端封测环节转为前端系统架构设计。 伴随 2.5D/3D先进封装的快速产业化，多家工艺厂虽然已具备成熟的关键工艺能力，但在实 际用户端落地时，却普遍面临"工艺复杂、设计难以调用"的鸿沟；与此同时，大量 AI、边缘 计算与高带宽场景的设计公司也发现， 在跨工艺、跨介质的多芯粒布局布线、互联分析和系 统级可靠性验证方面，传统 EDA方法已经难以应对。 在此背景下，先进封装 EDA必须重构设计范式，形成跨工艺、跨芯粒、跨物理场的系统协 ...

Core Insights - The article emphasizes that the artificial intelligence industry will continue to be a key focus in the hard technology sector in 2025, with significant growth in the global wafer foundry market, which reached $47.119 billion in Q3, a year-on-year increase of 27% [3][4]. Industry Overview - In Q3, TSMC accounted for 70% of the wafer foundry market share, an increase of 7 percentage points compared to the same period last year, positioning it as the leader in growth within the industry [3]. - The growth drivers in the wafer foundry sector are identified as data centers, industrial and automotive applications, and smartphones, with TSMC's advanced process and packaging orders contributing to a nearly 41% year-on-year growth in its foundry business [4]. Performance Metrics - The average capacity utilization rate for global wafer foundry businesses was 71% in Q3 2023, showing a recovery trend as it is expected to rise to 80% by Q3 2024 and reach 86% in 2025, indicating a return to a healthy operational phase [6]. - The semiconductor industry is projected to experience sustained high-quality growth through 2026, with a significant industry correction anticipated in Q2 2027 [6].

Core Insights - The article discusses the 2025 Heterogeneous Integration Frontier Forum held in Ningbo, focusing on advanced technologies and collaboration opportunities in the field of micro-LED and related materials [3][5]. Group 1: Industry Trends and Challenges - The forum attracted leading companies and research institutions to discuss cutting-edge results, technological trends, and key challenges in the industry [3]. - Key challenges in quantum dot applications include achieving high stability and high light conversion efficiency [10]. - The efficiency and transmission distance of UV LED optical communication are currently low, posing significant challenges [12]. Group 2: Technological Innovations - Continuous process optimization aims to reduce extreme thickness to 3-5 micrometers and TTV to less than 0.5 micrometers [8]. - Non-destructive Micro-LED technology can resolve material damage issues and production challenges, with hybrid bonding being the best bridge for semiconductor heterogeneous integration [14]. - GaN Die products with low dislocation density and non-destructive chemical peeling offer significant performance advantages, improving uniformity, brightness, and reliability [19]. Group 3: Material and Process Development - The development of GaN-on-Si epitaxy faces challenges such as low yield from the etching method and lattice mismatch between GaN and silicon [21]. - The ability to redefine MLED panel sizes and reduce seams enhances visual experience, with advancements in panel sizes from 15 inches to 27 inches [17]. - A one-stop capability for optical waveguide post-processing ensures comprehensive control over product quality, including parameters like surface cleanliness and optical performance [16].

Core Viewpoint - The establishment of the micro-nano platform at the Yongjiang Laboratory marks a significant advancement in the field of heterogeneous integration, providing a comprehensive open and shared platform for semiconductor research and development [1][5][11]. Group 1: Platform Overview - The micro-nano platform has a total construction area of 12,000 square meters, including a cleanroom area of 6,000 square meters, equipped with 165 high-end precision devices and a team of over 60 personnel [3]. - It focuses on "heterogeneous integration" and aims to provide a full-chain R&D verification service for the semiconductor industry, supporting scientific discovery, technology validation, and engineering realization [5][14]. Group 2: Significance and Impact - The platform is seen as a "hardcore support" for collaborative efforts between industry, academia, and research, breaking down barriers between scientific discovery and engineering transformation, thus driving the high-quality development of the integrated circuit industry in Ningbo and nationwide [7][9]. - The opening of the 8-inch verification line is expected to enhance Ningbo's engineering verification capabilities in micro-nano manufacturing, providing higher-level public services and innovation support for the next generation of semiconductor industry [9][11]. Group 3: Future Directions - The Yongjiang Laboratory aims to create an open and shared infrastructure that serves as a neutral and credible enabling platform, linking industry, academia, and research to provide critical support for innovation and commercialization [20]. - The laboratory is committed to accumulating key verification data and exploring feasible paths from pilot testing to mass production in collaboration with academia and industry [20].

Core Viewpoint - The article discusses the recent "2025 Heterogeneous Integration Frontier Forum" held in Ningbo, focusing on advancements in heterogeneous integration technology and its implications for various industries, particularly in optical interconnects and chiplet technologies [3]. Group 1: Forum Highlights - The forum attracted leading companies and research institutions from both domestic and international backgrounds, facilitating in-depth discussions on cutting-edge achievements, technological trends, and key challenges in the field [3]. - Key topics included the challenges in high-speed optical interconnect chip manufacturing, where domestic capabilities are strong in design and demonstration but face issues in mass production and reliability [8]. Group 2: Technological Challenges - The new technical challenges in heterogeneous integration chiplet technology primarily revolve around signal integrity, power integrity, multi-physical field issues, and electromagnetic interference [9]. - The development of optical interconnect solutions is seen as essential for overcoming AI computing power bottlenecks, emphasizing the need for collaborative innovation in devices and advanced packaging technologies [16]. Group 3: Industry Trends - The integration of heterogeneous and optoelectronic technologies is identified as a significant future direction, with AI technology being a major driver for the growth in advanced packaging demands [18]. - The transition from 2G to 5G has significantly increased the value of RF components in mobile devices, with the value of RF devices per smartphone rising from $0.5 to over $12 [22].

Core Viewpoint - The article discusses the advancements and challenges in heterogeneous integration technology, particularly in the context of the 2025 Heterogeneous Integration Frontier Forum held in Ningbo, highlighting the importance of collaboration among industry leaders and research institutions to drive innovation in this field [3]. Group 1: Heterogeneous Integration Technology - Advanced chip technologies such as AI, high-speed computing, and 5G/6G are driving the development of multi-chip heterogeneous integration technology, with mixed bonding technology offering advantages like smaller pitch (<2um), higher I/O density (1000X), and lower power consumption [8]. - The 2.5D/3D stacked chip design is a trend, with 2.5D Chiplet design tools becoming mature, emphasizing the need for collaboration across chip design, packaging, and EDA design [12]. - The period from 2026 to 2028 is critical for the acceleration of advanced packaging technology, which will also drive growth in supply chain materials and equipment markets [16]. Group 2: Market Demand and Applications - The magnetic sensor market has a vast application range across industrial control, medical, automotive, and consumer electronics, with annual sales reaching billions of units and a market value of hundreds of billions of dollars [18]. - High-density integrated circuit manufacturing and advanced packaging materials are crucial for the semiconductor industry chain in China, with a strong emphasis on domestic material innovation and industrialization [24]. Group 3: Technical Challenges and Innovations - Key challenges in semiconductor hybrid bonding integration technology include controlling bonding bubbles, improving edge quality, and ensuring uniform bonding energy [31]. - The development of melting/mixed bonding technology is essential for future 3D integration, with optimized chuck designs reducing local stress and improving overlay performance [37]. - Advanced packaging mass production faces difficulties related to surface smoothness, cleanliness, alignment precision, thermal control, efficiency, and yield [39].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, organized by the Yongjiang Laboratory and TrendBank, with support from the Ningbo Electronic Industry Association [2][50]. - The forum aims to discuss advancements in heterogeneous integration technologies and their applications in various fields, including semiconductor manufacturing and optical technologies [26][30]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300-500 participants [50]. - The event will feature a series of keynote speeches, panel discussions, and networking opportunities, focusing on topics such as advanced packaging technologies, optical chip innovations, and the future of semiconductor integration [26][30][50]. Registration and Fees - Registration for the forum is available, with ticket prices set at RMB 2500 per person, which includes access to conference materials, lunch, and a gala dinner [50]. - Early bird registration before October 31 offers a discounted price of RMB 2000, and students can obtain tickets for RMB 1500 by contacting the organizers [50]. Agenda Highlights - The agenda includes a variety of topics such as the launch of the 8-inch verification line at the Yongjiang Laboratory, government speeches, and discussions on the latest trends in heterogeneous integration and advanced packaging technologies [6][26][30]. - Notable speakers include experts from leading semiconductor companies and research institutions, discussing innovations in chip design, manufacturing processes, and market trends [26][30][50].

Core Viewpoint - The 2025 Heterogeneous Integration Frontier Forum will be held in Ningbo, focusing on the challenges and breakthroughs in heterogeneous integration technology for chip applications, promoting industry collaboration and innovation [2][3][33]. Group 1: Event Details - The forum will take place from November 18-19, 2025, at the Pan Pacific Hotel in Ningbo, organized by Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][33]. - The event aims to gather experts from academic institutions, industry groups, and investment institutions to discuss the current state and future trends of advanced packaging technology [3][33]. Group 2: Participating Companies - Notable participants include Beijing Vikaitech, All-Semi Micro Electronics, Oxford Instruments, and several others, showcasing their core products and unique technologies at the forum [3][11][12][16][20]. - The forum will feature a variety of exhibitors, including companies specializing in semiconductor equipment, advanced packaging, and micro-nano fabrication technologies [11][16][22][24]. Group 3: Forum Objectives - The forum aims to facilitate discussions on the integration of material growth, device fabrication, advanced packaging, and reliability assessment, addressing the industry's pressing challenges [5][29]. - It seeks to enhance collaboration among different sectors of the semiconductor industry, including new entrants and established players, to foster innovation and development [3][29]. Group 4: Registration and Participation - Registration for the forum is available, with different ticket types offered, including early bird discounts for those who register before October 31 [34]. - The expected attendance is between 300 to 500 participants, indicating a significant interest in the topics to be discussed [33].