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LG铜柱基板技术,将革命手机
半导体芯闻·2025-07-11 10:29

Core Viewpoint - LG Innotek has successfully developed the world's first copper post (Cu-Post) technology for mobile semiconductor substrates, which enhances smartphone performance and reduces thickness by replacing traditional solder balls with copper posts [1][2]. Group 1: Technology Development - The Cu-Post technology allows for a 20% reduction in spacing between solder balls, increasing packaging density compared to traditional methods [1]. - Copper's higher melting point compared to solder ensures structural stability during high-temperature processes, preventing deformation or displacement of solder balls [1]. - The thermal conductivity of copper is approximately seven times greater than that of traditional solder, facilitating faster heat dissipation [1]. Group 2: Business Strategy and Goals - LG Innotek aims to focus on high-value products such as FC-BGA and RF-SiP substrates, as well as vehicle AP modules, with a target of exceeding $2.2 billion in annual revenue by 2030 [2]. - The company has secured around 40 patents related to its Cu-Post technology and plans to apply it to RF-SiP and FC-CSP substrates [1][2]. Group 3: Challenges and Considerations - The microstructure manufacturing process requires extremely high precision, making chip integration and production yield management challenging [2]. - The cost of copper is higher than that of solder, necessitating careful evaluation of return on investment in the industry [2].