靠着HBM挣大钱的设备巨头

Core Viewpoint - The semiconductor equipment manufacturer DISCO is experiencing significant growth driven by the increasing demand for precision processing equipment, particularly due to the rise of generative AI and high-bandwidth memory (HBM) technology [1][2][3]. Group 1: DISCO's Performance - DISCO's non-consolidated shipment amount for the first quarter of fiscal year 2025 is expected to reach 93 billion yen, marking an 8.5% year-on-year increase and achieving the fifth consecutive quarter of growth [1][2]. - The company has revised its revenue forecast for the first quarter of fiscal year 2025 from 75 billion yen to 89.9 billion yen, reflecting a 19.9% increase [5][6]. - The operating income forecast has been adjusted from 23.8 billion yen to 34.5 billion yen, indicating a 44.9% increase [6]. Group 2: HBM and AI Demand - HBM technology is crucial for the development of generative AI, as it meets the need for rapid data access and storage, thus driving the sales of semiconductor manufacturing equipment [3][9]. - The demand for HBM is not only benefiting DISCO but also numerous semiconductor backend equipment manufacturers, showcasing significant market potential [3][9]. Group 3: Industry Trends - The global market for TCB (Thermal Compression Bonding) equipment used in HBM packaging is projected to grow from approximately $460 million in 2024 to over $1.5 billion by 2027, with a compound annual growth rate exceeding 50% [33][34]. - Companies like Hanmi Semiconductor and ASMPT are emerging as key players in the HBM TCB equipment market, with Hanmi Semiconductor achieving record sales and significant profit growth [34][35]. - The competitive landscape is evolving, with multiple companies, including K&S and Zeus, also making strides in the HBM equipment sector, indicating a shift from a single dominant player to a more diversified market [43][52].