2 纳米良率大战

Core Insights - TSMC's N2 process is leading the industry with a yield of approximately 65% expected by mid-2025, significantly surpassing its competitors [1][4] - Intel's 18A process has shown remarkable improvement, reaching a yield of 55%, with potential to increase to 65%-75% by optimizing processes [2][3] - Samsung's SF2 process is lagging with a yield of only 40%, facing significant challenges that need to be addressed to remain competitive [4] TSMC's N2 Process - TSMC is investing in improving the yield of its N2 process, aiming for close to 75% by 2026 [1] - The company is addressing technical challenges such as stitching and overlay control in EUV lithography to enhance yield and performance [1] - Comprehensive optimizations, including advanced pellicles to reduce contamination, are being implemented to boost yield [1] Intel's 18A Process - Intel's 18A process yield has improved from 50% to 55%, indicating successful defect reduction and process optimization [2] - The company plans to start mass production of the Panther Lake processor using the 18A process by the end of 2025 [2] - Future enhancements with the Intel 18A-P version are expected to further improve yield and competitiveness [2][3] Samsung's SF2 Process - Samsung's SF2 process yield remains at 40%, attributed to wafer-level defects and slow EUV patterning capability improvements [4] - The next-generation 2nm node is expected to launch in early 2027, but significant yield improvements are needed beforehand [4] - Samsung faces a challenging task to catch up with TSMC and Intel, requiring breakthroughs in technology and yield optimization [4]