嵌入式光传输技术，CPO的到来将推动人工智能超级计算的拓展

Core Viewpoint - The report from Counterpoint Research highlights the significant growth potential of integrated semiconductor optical modules, particularly embedded optical interconnects, which are expected to achieve a compound annual growth rate (CAGR) of 50% by 2033, driven by advancements in AI and high-bandwidth network architectures [2][3]. Group 1: Market Trends - The shipment volume of integrated optical solutions, including On-Board Optical (OBO), Near-Package Optical (NPO), and Co-Packaged Optical (CPO), is projected to grow at a CAGR of 50% by 2033 [2]. - The transition from copper to optical technology is anticipated to enhance bandwidth and reduce power consumption, with embedded optical modules expected to see a significant increase in adoption [2][3]. - By 2027, widespread adoption of NPO and CPO is expected to drive a triple-digit year-on-year revenue growth, with their share in total shipments reaching double digits [2][3]. Group 2: Technological Advancements - CPO is identified as a game changer for AI computing, enabling ultra-high bandwidth expansion and significant reductions in power consumption [3][5]. - The shift towards "less copper, more light" will lead to a substantial decrease in copper usage at each stage of transition from OBO to NPO to CPO, resulting in nonlinear performance improvements [7]. - The performance of 3D CPO solutions may exceed current technologies by up to 80 times, marking a significant leap in capabilities [7]. Group 3: Key Players - Major companies leading the CPO field include NVIDIA, Intel, Marvell, and Broadcom, with ongoing technological evolution expected to be a gradual process [3][5].