高分辨率与高产出加持，尼康推出首款FOPLP光刻系统

Core Viewpoint - Nikon has announced the launch of its first backend lithography system, the digital lithography system DSP-100, which will start accepting orders in July 2025, specifically designed for advanced packaging applications [2][11]. Financial Performance - For the fiscal year 2024, Nikon's lithography business revenue is approximately $1.25 billion. The shipment of integrated circuit lithography machines was 32 units, a decrease of 13 units compared to 2023. The breakdown includes 4 ArFi machines (down 5), 7 ArF machines (down 3), 3 KrF machines (up 1), and 18 i-line machines (down 6). For FPD lithography machines, 28 units were shipped, a significant decrease of 40% compared to 2021 [4][5]. Product Features - The DSP-100 system supports large substrates up to 600 square millimeters and offers a high resolution of 1.0μm L/S. It combines Nikon's high-resolution semiconductor lithography technology with multi-lens technology from its FPD lithography systems, achieving a throughput of up to 50 panels per hour using 510x515mm substrates [9][11]. Market Trends - The demand for high-performance semiconductor devices is rapidly increasing due to the widespread application of IoT and generative AI technologies, particularly in data centers. Advanced packaging technologies, such as chip-on-chip connections, are evolving, leading to finer circuit patterns and larger packaging sizes. Consequently, the demand for panel-level packaging (PLP) using resin or glass substrates is expected to continue growing [6].