半导体行业观察·2025-07-29 01:14Core Insights - The CMOS image sensor (CIS) market is expected to experience strong growth in 2024, driven by the rebound in smartphone demand and needs in security, defense, aerospace, and consumer electronics. Revenue is projected to grow by 6.4% in 2024, following a 2.3% increase in 2023, with a compound annual growth rate (CAGR) of 4.4% from 2024 to 2030 [1][4]. Market Trends - The market volume is anticipated to rise from 7 billion units to 9 billion units by 2030, with mobile, security, and automotive applications being the primary growth drivers [1]. - The average selling price (ASP) remains stable above $3, supported by high-end features in mobile and automotive sectors [1]. - Wafer production is expected to grow by 8.9% in 2024, with a steady increase projected until 2030 [1]. Competitive Landscape - Chinese company Smartsens leads the market with a significant year-on-year growth of 105.7%, expanding into mobile and automotive sectors. Sony's market share has also increased by nearly 50%, while SK Hynix has reduced its focus on CIS, concentrating on memory products [4]. - Companies like ON Semiconductor, Teledyne, and STMicroelectronics have seen revenue declines due to slowdowns in industrial and medical markets, as well as reduced design orders in consumer electronics [4]. - Despite trade tensions, the CIS sector remains resilient due to the adoption of mature nodes, with domestic demand and government support bolstering production in China [4]. Technological Innovations - The CIS industry is evolving through innovations that enhance performance, integration, and sensing capabilities, including higher signal-to-noise ratios, improved low-light sensitivity, compact designs, and lower power consumption [7]. - Sony's three-layer stacked sensors are being adopted in mainstream smartphones, marking a shift towards intelligent sensing rather than just resolution [7]. - Advances in 22nm logic stacking technology aim for ultra-low power consumption and expanded computational capabilities, with FDSOI technology expected to be utilized for neuromorphic sensing [7]. Future Projections - By 2030, global CIS wafer capacity is projected to meet demand with a capacity of 638k wpm and a utilization rate of 72% [4]. - The industry is witnessing a transition towards multi-stacking architectures, with BSI (Backside Illumination) technology leading the way [8].