QYResearch·2025-07-29 10:09Core Viewpoint - The CMP (Chemical Mechanical Polishing) pad market in China is projected to reach USD 470 million by 2031, with a compound annual growth rate (CAGR) of 8.3% during the forecast period [2]. Group 1: Market Overview - The CMP pad market is driven by the increasing wafer sizes, particularly 8-inch and 12-inch wafers, with a potential shift towards 18-inch wafers, which raises production challenges for CMP pads [2]. - The current leading product type in the market is polymer CMP pads, accounting for approximately 90.76% of the market share [6]. - The primary application segment is 300mm wafers, which holds about 77.11% of the market share [8]. Group 2: Competitive Landscape - Major manufacturers in the Chinese CMP pad market include DuPont and Hubei Dinglong, with the top three companies holding around 95.0% of the market share by 2024 [5]. - The market is characterized by high entry barriers due to the need for specialized technology, rigorous performance requirements, and significant capital investment for R&D and manufacturing [9]. Group 3: Future Trends and Challenges - As the demand for enhanced semiconductor performance grows, the requirements for CMP pad polishing performance will become increasingly stringent [2]. - The market is expected to see a shift towards domestic production opportunities due to geopolitical factors, with local companies potentially adopting aggressive pricing strategies to capture market share [8][9]. - The competitive landscape will likely see a narrowing of price differences among brands, leading to fluctuations in profit margins [9].