深圳大学教授创业AI芯片主动式散热，「锐盟半导体」再获数千万融资｜早起看早期

Core Viewpoint - The article highlights the rapid growth and investment in Shenzhen RuiMeng Semiconductor, which focuses on active cooling micro-systems for high-performance chips, addressing the critical thermal management needs in AI applications [6][10]. Company Overview - Shenzhen RuiMeng Semiconductor has recently secured several million RMB in pre-A+ round funding from Yida Capital and Hechuang Capital, marking its third financing round within a year, bringing the total annual financing close to 100 million RMB [6]. - Founded in 2020, RuiMeng is a rare vertical integration micro-system solution provider in China, developing a complete technology loop from materials to devices, chips, and algorithms [6]. Market Demand and Challenges - The explosion of AI terminal computing power has made thermal management a key bottleneck for performance release, with flagship devices like those using the Snapdragon 8s processor experiencing significant thermal challenges [7]. - The need for effective cooling solutions is urgent due to the rise of AI models, with both cloud and edge chips requiring advanced thermal management [7]. Product Innovation - RuiMeng's product, the MagicCool micro-pump, achieves a breakthrough balance between millimeter-level thickness and industrial-grade cooling efficiency, utilizing piezoelectric MEMS technology [8]. - The product specifications include a flow rate of 2 L/min, power consumption of 200 mW, back pressure of 420 Pa, and a heat transfer coefficient of 330 W/(m²·K), indicating leading performance metrics [8]. Competitive Advantages - RuiMeng Semiconductor boasts five competitive advantages: a team skilled in multi-physical field modeling, unique cavity and flow channel designs, self-developed piezoelectric materials, customized SoC chips, and strong supply chain capabilities [9]. Investor Insights - Investors from Yida Capital and Hechuang Capital emphasize the urgent need for innovative cooling solutions in the face of rising thermal demands due to AI integration in devices, highlighting RuiMeng's potential to lead future cooling system developments [10][11].