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群创FOPLP已量产,他的竞争对手都有谁?
势银芯链·2025-08-05 06:21

Core Viewpoint - The article discusses the advancements and market potential of Fan-Out Panel Level Packaging (FOPLP) technology, highlighting its significance in the semiconductor industry and the competitive landscape among companies involved in this technology [2][3][4]. Summary by Sections FOPLP Technology Overview - FOPLP technology is being adopted by companies like Innolux, which has begun shipping its Chip-First products, with an initial monthly output of several million units, aiming to increase to tens of millions by the end of the year [2]. - The technology is crucial for AI applications and leverages the large-area production capabilities of panel manufacturers to enhance efficiency and reduce costs [3]. Advantages of FOPLP - FOPLP uses square panels as substrates, allowing for a higher chip placement density compared to traditional wafer-level packaging, achieving a substrate utilization rate greater than 95% [3]. - The packaging cost of FOPLP is projected to be at least 50% lower than that of wafer-level packaging, providing a significant cost advantage [3]. Market Demand and Challenges - The demand for FOPLP is driven by the shortage of CoWoS capacity, making it a preferred solution for alleviating packaging capacity constraints [4]. - However, challenges such as the lack of standardization in panel sizes, warping issues during packaging, and precision limitations remain significant hurdles [4]. Company Developments - Companies like ASE and Powertech have been investing in FOPLP solutions, with ASE expanding its rectangular panel sizes and Powertech entering small-scale production [5]. - BOE has transitioned from display panels to advanced packaging, planning to achieve mass production of glass substrate packaging by 2026 [5]. - Other companies, including Huazhong University of Science and Technology and Suzhou Yimai Semiconductor, are also making strides in FOPLP technology, focusing on high-density packaging solutions [5].