重磅！国际半导体低温键合会议首次来华

Core Viewpoint - The 2025 China International Low-Temperature Bonding 3D Integration Technology Seminar successfully held in Tianjin, focusing on cutting-edge developments in low-temperature bonding 3D integration technology, attracting over 200 experts and representatives from various countries [1][5]. Group 1: Event Overview - The seminar was co-hosted by several prestigious organizations, including the Chinese Academy of Sciences and Xi'an University of Electronic Science and Technology, with notable honorary chairs from top universities and companies [3][5]. - This event marks the first time the seminar has been held in China since its inception in 2007, emphasizing international collaboration in semiconductor wafer bonding technology [5][25]. Group 2: Key Themes and Discussions - The seminar covered six major themes: surface activation bonding and its applications, hybrid bonding and 3D integration, new low-temperature bonding processes and materials, power, RF, optoelectronic, micro-systems, and display devices, basic principles and characterization, and heterogeneous integration and related materials [5][25]. - Eleven keynote speeches were delivered by experts, discussing topics such as the history and future of surface activation bonding, advancements in wide bandgap semiconductor devices, and the latest developments in 3D integration technology [21][23]. Group 3: Academic and Industrial Collaboration - The seminar facilitated deep collaboration between academia and industry, accelerating research and application of low-temperature bonding technology across various fields [25]. - Over ten industry chain enterprises, including Qinghe Crystal Semiconductor Technology, participated in the exhibition, covering critical areas such as diamond materials, bonding equipment, ultrasonic cleaning equipment, and testing instruments [26].