中国有了自己的“一位难求”国际化半导体展

Core Viewpoint - The CSEAC 2025, a significant semiconductor exhibition in China, showcases the country's growing influence and capabilities in the semiconductor industry, with a focus on professionalization, industrialization, and internationalization [1][4][5]. Group 1: Event Overview - CSEAC 2025 will take place from September 4 to 6 at the Wuxi Taihu International Expo Center, highlighting China's authoritative position in the semiconductor equipment and core components sector [1]. - The exhibition has seen a 40% year-on-year increase in the number of exhibitors, with over 1,000 exhibitors expected and an exhibition area exceeding 60,000 square meters [5][4]. - Nearly 200 international exhibitors are participating, indicating a growing trend of global engagement in the event [5]. Group 2: Industry Impact - The event serves as a platform for technology exchange, trade negotiations, market expansion, and product promotion, with over 20 specialized forums addressing market hotspots and industry pain points [4][8]. - The theme for this year's event is "Strengthening China's Chip, Embracing the Chip World," reflecting the strategic importance of the semiconductor industry to the national agenda [5]. Group 3: Talent Development - CSEAC 2025 emphasizes talent development through a dedicated talent zone, integrating education and industry needs, with participation from nearly 30 renowned universities and over 100 leading enterprises [8]. - The event aims to bridge the gap between talent cultivation, research innovation, and industry demand, fostering a robust ecosystem for semiconductor talent in China [8]. Group 4: Global Collaboration - The exhibition will feature a "Global Semiconductor Industry Chain Cooperation Forum," gathering industry leaders and technical experts to discuss key technologies in the semiconductor field [7]. - The introduction of the "IC Elite Lecture Hall" aims to facilitate knowledge sharing and collaboration among international experts and industry leaders, focusing on critical areas such as AI computing clusters and advanced packaging detection [7].