全球算力散热结构件行业应用领域市场份额细分调查2025年调研数据

Core Viewpoint - The global market for computing heat dissipation structural components is projected to reach $2.489 billion by 2031, with a compound annual growth rate (CAGR) of 20.4% in the coming years [2]. Market Overview - The computing heat dissipation structural components are essential for high-performance devices such as AI servers and GPU acceleration cards, providing mechanical support and thermal conduction paths [2]. - The materials and processes used in these components, such as copper alloys and aluminum carbide, directly influence the heat dissipation efficiency and reliability of computing devices [2]. Market Segmentation Server Sector - The server sector holds the largest market share for computing heat dissipation structural components, specifically designed to manage heat from high-performance computing chips [8][9]. - Liquid cooling technology is becoming mainstream due to its efficiency, with cold plate liquid cooling leading in deployment, while immersion cooling is seen as a long-term direction [10]. Consumer Electronics - In consumer electronics, these components are designed to manage heat from high-performance chips in devices like smartphones and laptops, with a focus on lightweight and high-performance requirements [13]. - Innovations include the use of graphene films and heat pipes, with a trend towards integrated and intelligent cooling systems [13]. Communication Equipment - For communication devices, the components are tailored to ensure stable operation of high-density equipment like 5G base stations, utilizing advanced materials and liquid cooling technologies [16]. - The market is evolving towards smaller, more efficient designs, with liquid cooling technologies replacing traditional air cooling [16]. Other Applications - Beyond the main sectors, computing heat dissipation structural components are also applicable in automotive computing, industrial computers, and medical devices, addressing the unique thermal management needs of these environments [19]. - Trends include lightweight designs and integration with battery thermal management in automotive applications, as well as noise reduction in medical devices [20].