Core Viewpoint - The semiconductor packaging leader, ASE Technology Holding Co., announced a significant acquisition to enhance its advanced packaging capacity, driven by strong demand from high-performance computing (HPC) clients and the growing need for advanced packaging solutions [2][4]. Group 1: Acquisition and Expansion Plans - ASE Technology plans to acquire a facility from Win Semiconductors for NT$6.5 billion (approximately US$215 million) to expand its advanced packaging capacity in Kaohsiung [2]. - The new facility acquisition is expected to contribute NT$19.39 billion (approximately US$640 million) in profits, translating to a pre-tax earnings contribution of NT$4.57 per share [2]. - ASE's new K28 plant is set to begin construction in October 2024 and is expected to be completed by 2026, focusing on CoWoS advanced packaging capacity [2][3]. Group 2: Financial Performance and Projections - ASE's revenue for the third quarter is projected to increase by 12% to 14% in USD terms, with a corresponding increase of 6% to 8% in New Taiwan Dollar terms, despite a slight decline in gross margin due to currency appreciation [3][4]. - The advanced packaging and testing business is expected to contribute an additional US$1 billion in revenue compared to 2024, representing a 10% annual growth rate for the packaging segment [3][4]. - The company anticipates that the demand for high-end packaging, particularly 2.5D and 3D packaging, will continue to rise, necessitating the expansion to alleviate capacity constraints [3][4]. Group 3: Market Outlook and Strategic Positioning - ASE is optimistic about the recovery of the global semiconductor market by 2026, leveraging its technological leadership and capacity advantages to solidify its market position [4]. - The company aims to enhance its turnkey services, integrating advanced packaging and testing, with testing revenue growth expected to outpace packaging revenue growth this year [3][4]. - ASE's revenue for July reached NT$51.542 billion, marking a 4.1% month-over-month increase and a 7.95% year-over-year increase for the first seven months of the year [4].
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半导体行业观察·2025-08-12 00:52