三星芯片，强势复苏？

Core Viewpoint - Samsung Electronics' semiconductor business is showing signs of recovery due to large-scale foundry orders from major U.S. tech companies, with market attention on whether this momentum will extend to its flagship memory chip business [2] Group 1: HBM3E and HBM4 Developments - The first turning point for Samsung's memory business recovery will be its timeline for supplying high-bandwidth memory (HBM3E) chips for NVIDIA's AI accelerators [2] - Analysts predict that Samsung will complete the certification of its 12-inch HBM3E chips by the end of August and begin mass production in the fourth quarter [3] - Morgan Stanley reports that Samsung expects its HBM3E sales to reach a high level of 90% in the second half of the year, indicating full shipments to major customers [3] - Samsung's next potential turning point will be the supply of HBM4 chips, expected to become mainstream for NVIDIA's next-generation AI processor by 2026 [4] - Samsung has completed the development of HBM4 products and is transitioning to the 1c DRAM process, sending samples to major customers [4] Group 2: Competitive Landscape - Samsung is investing in new production facilities to recover from previous setbacks, while SK Hynix is delaying large-scale expenditures until confirming supply commitments with major clients [6] - Analysts suggest that if Samsung successfully supplies HBM4 to NVIDIA, it could regain market leadership lost for nearly 30 years [6] - Market tracking agency Omdia reports that as of Q1 2025, SK Hynix held a 36.9% share of the DRAM market, surpassing Samsung's 38.6% [7] Group 3: Technological Advancements - Samsung is using the more advanced 1c process for HBM4 chips, while SK Hynix plans to use the previous generation 1b DRAM [8] - SK Hynix is actively transitioning to EUV technology for the development of next-generation DRAM, planning to increase the number of EUV layers in its 1c DRAM [10][11]