Core Viewpoint - The article highlights the significant advancements in China's semiconductor industry, particularly the development and potential market impact of domestically produced HBM3 memory chips, which could disrupt the current dominance of major global players like Samsung, SK Hynix, and Micron [2][5]. Group 1: HBM3 Development and Market Impact - Domestic DRAM leader has begun supplying HBM3 samples to Huawei, manufactured using a self-developed 16nm G4 process, awaiting mass production approval [2]. - The G4 process allows for a 20% reduction in chip size and significant energy efficiency improvements compared to the previous 18nm G3 process, positioning China as the third country capable of mass-producing HBM3 after South Korea and the USA [2]. - The integration of HBM3 chips into Huawei's Ascend 910C AI chip is expected to enhance AI computing capabilities significantly, with a 40% increase in inference speed and a 30% improvement in energy efficiency [3][4]. Group 2: Competitive Landscape - The global HBM market is currently dominated by SK Hynix, which holds over 50% market share, followed closely by Samsung and Micron [4]. - In response to the emergence of domestic HBM3, international competitors are accelerating their technology iterations, with SK Hynix planning to start mass production of the world's first 12-layer HBM3E by September 2024 [4]. - Micron aims to achieve parity in HBM market share with its overall DRAM share (approximately 25%) by the second half of 2025 [4]. Group 3: Future Outlook and Strategic Positioning - Analysts predict that the large-scale application of domestic HBM3 will compel international manufacturers to accelerate technology transfer, potentially leading to a 20%-30% decrease in HBM3e prices over the next two years [5]. - The Chinese semiconductor industry is leveraging "cost-performance + localization" strategies to capture a share of the mid-to-high-end market [5]. - By 2025, domestic HBM market demand is expected to exceed 120 million GB, accounting for 30% of the global total, driven by policies such as the "East Data West Computing" project [6].
国产 HBM3 芯片突破!华为获供后,存储三巨头格局生变
是说芯语·2025-08-13 09:43