日月光成最大赢家

Group 1 - The core viewpoint of the article highlights the strong demand for advanced packaging in the semiconductor industry, driven by AI and high-performance computing needs, as well as the ongoing effects of the "packaging and testing whitelist" that benefits leading companies like ASE Technology [1][2] - ASE Technology announced on August 11 that it will spend NT$6.5 billion to acquire a facility from Wistron in the Kaohsiung area, indicating its intent to expand its advanced packaging capacity [1][2] - The company has already raised its capital expenditure three times this year, projecting a total of US$5.5 billion, the highest in its history, with US$3 billion allocated for equipment purchases and NT$2.5 billion for facility construction [2] Group 2 - The semiconductor packaging industry in China is growing, with notable companies like Changjiang Electronics Technology and Tongfu Microelectronics, but ASE's reputation for quality and competitive pricing keeps Chinese customers returning to its facilities [1] - The overall market for consumer and automotive electronics is recovering, which further supports ASE's optimistic outlook for the second half of the year [2] - ASE's recent acquisition of a facility totaling 21,800 square meters will be dedicated to advanced packaging, reflecting the company's commitment to meeting increasing demand despite uncertain market conditions [2]