芯片巨头，唱衰NAND！

Group 1 - Major South Korean semiconductor companies, including Samsung Electronics and SK Hynix, are slowing down investments in advanced NAND due to high demand uncertainty and a focus on DRAM and packaging sectors [1][2] - Samsung Electronics has been transitioning investments at its P1 and Xi'an NAND factories from 6th and 7th generation NAND to 8th and 9th generation NAND, with conversion investments being more efficient and less costly than building new production lines [1] - The conversion speed for the latest NAND technology is slowing, with the 9th generation NAND conversion at the P1 factory being delayed and the Xi'an factory's X2 production line only planning to execute a minimal scale of 5,000 wafers per month [1][2] Group 2 - A semiconductor industry insider indicated that Samsung plans to continue mass production of older generation NAND on the X2 production line until at least mid-next year due to low demand for advanced NAND [2] - Samsung has decided to postpone the application of hybrid bonding technology for V9 NAND, originally intended for the Xi'an X2 production line, with plans to start using this technology from the 10th generation NAND (V10) at the earliest by mid-next year [2] - SK Hynix is also focusing its investments on advanced DRAM and HBM, with slower R&D progress for V10 NAND compared to Samsung, leading to a cautious investment approach based on downstream demand [2]