年产50万颗，三维异构光波导芯片产线投产

Core Viewpoint - Deep Valley Technology has successfully established a production line for glass-based 3D waveguide chips, marking a significant breakthrough in the industrialization of core technologies for 3D waveguides, which will support multi-core optical interconnects and next-generation data center communications [2][4]. Group 1: Production Line and Technology - The newly built production line utilizes self-developed femtosecond laser direct writing equipment and is equipped with high-precision dual six-axis automatic coupling platforms, enabling rapid processing and efficient testing of 3D waveguide structures [4]. - The chip processing efficiency can reach 10 seconds per chip, with an annual production capacity exceeding 500,000 chips [4]. - The first batch of mass-produced products focuses on four-core and dual four-core waveguide chips, which can be widely applied in multi-core optical fiber fan-in and fan-out devices as well as multi-core optical modules [4]. Group 2: Market Demand and Future Prospects - Compared to traditional parallel transmission solutions, the 3D waveguide solution significantly reduces the complexity and cost of fiber optic wiring, meeting the demand for data centers evolving towards 800G, 1.6T, and 3.2T ultra-large capacities [4]. - The scalable process platform also provides technological support for the mass production of seven-core and more channel chips in the future [4]. - The chairman of Deep Valley Technology, Dr. Du Leping, stated that the glass-based 3D waveguide chip is a core device for the next generation of high-density optical interconnects, and the production line's launch positions the company to gain a competitive edge in the global optical communication market [4]. Group 3: Company Background - Deep Valley Technology is a national high-tech enterprise focused on the research, design, production, and sales of optical communication chips and devices, established by a high-level talent team introduced by Shenzhen [5]. - The core team consists of top global experts in optical communication and semiconductor technology, covering cutting-edge fields such as 3D waveguides, TGV chips, and advanced CPO packaging, achieving key technological breakthroughs [5]. - Team members hail from prestigious institutions such as the University of Science and Technology of China, Nanyang Technological University, Hong Kong University of Science and Technology, and Shanghai Jiao Tong University, possessing extensive experience in high-speed optical communication device design and industrialization [5].