Core Viewpoint - Huawei introduced the UB-Mesh technology at the Hot Chips 2025 conference, aiming to unify all interconnections within AI data centers using a single protocol, which will be made available for free to all users next month [1][5][27]. Summary by Sections UB-Mesh Technology - UB-Mesh is designed to replace multiple existing protocols (PCIe, CXL, NVLink, TCP/IP) to reduce latency, control costs, and enhance reliability in gigawatt-level data centers [1][5]. - The technology allows any port to communicate with others without conversion, simplifying design and reducing conversion delays [5][10]. SuperNode Architecture - Huawei defines SuperNode as an AI architecture for data centers that can integrate up to 1,000,000 processors (CPU, GPU, NPU), pooled memory, SSDs, NICs, and switches into a single system [7][26]. - The architecture aims to increase chip bandwidth from 100 Gbps to 10 Tbps (1.25 TB/s) and reduce jump latency from microseconds to approximately 150 ns [7][10]. Reliability and Cost Efficiency - Huawei acknowledges challenges in transitioning from copper cables to pluggable fiber links, proposing mechanisms to ensure continuous operation even if individual links or modules fail [14][23]. - The cost of traditional interconnects increases linearly with the number of nodes, while UB-Mesh's cost scales sub-linearly, making it more cost-effective as capacity increases [23][27]. Industry Implications - If successful, UB-Mesh could reduce Huawei's reliance on Western standards like PCIe and NVLink, positioning the company to offer a comprehensive data center solution [26][27]. - The industry's interest in adopting UB-Mesh remains uncertain, as competitors like Nvidia and AMD are promoting their own interconnect technologies [27][28].
挑战Nvlink,华为推出互联技术,即将开源
半导体行业观察·2025-08-28 01:14