买下最贵光刻机，三星发力1.4nm

Core Viewpoint - Samsung is investing heavily in advanced semiconductor manufacturing technology, particularly in the development of 2nm and 1.4nm processes, to compete with TSMC, despite facing significant cost challenges and market share losses [1][2][3]. Group 1: Samsung's Technological Advancements - Samsung has installed a high numerical aperture EUV lithography machine for 1.4nm wafer production and aims to produce 1.4nm chips by 2027, seeking to gain a competitive edge over TSMC [1][2]. - The company has reportedly resolved yield issues related to the 2nm GAA node, with plans to mass-produce the Exynos 2600 later this year [1][2]. Group 2: Government Support and Cost Reduction - The South Korean government plans to eliminate import tariffs on semiconductor manufacturing equipment to support Samsung's competitiveness in the global market [2][4]. - The government is also discussing reducing tariffs on materials used in wafer manufacturing, which is expected to significantly alleviate the financial burden on semiconductor companies [4]. Group 3: Market Position and Competition - Samsung has lost its position as the global leader in DRAM to SK Hynix, marking a significant shift in market dynamics, with Samsung's market share gap with TSMC widening to 62.9 percentage points [2][3]. - The competitive landscape is intensifying, with SK Hynix also investing in advanced EUV lithography technology to enhance its product performance and cost competitiveness [3].