硅光芯片，强强联合

Core Viewpoint - The explosive growth in AI computing demand is driving the semiconductor industry towards new technologies like Co-Packaged Optics (CPO), with potential market value reaching tens of billions by 2026, particularly benefiting companies collaborating with NVIDIA and TSMC [2][4]. Group 1: AI and Semiconductor Industry Dynamics - The collaboration between TSMC and NVIDIA aims to capture significant opportunities in AI data centers, with the introduction of the Rubin architecture and CPO technology [2]. - Companies such as Borowiec and Guangsheng are positioned to lead in fiber optic components and connectors, while others like Zhisheng and Hongsu are entering the packaging and testing equipment supply chain [2][3]. Group 2: Technological Advancements - TSMC has developed a complete process design kit (PDK) for photonic integrated circuits (PIC), showcasing its technological capabilities in optical solutions [3]. - The CPO technology, utilizing micro-ring modulators, is expected to enhance power efficiency by 3.5 times and network resilience by 10 times, addressing the bottlenecks in AI computing [3]. Group 3: Market Projections - If the Rubin architecture is fully implemented, it could create a new market worth over $10 billion by 2026, with CPO expected to account for over 50% of high-speed data transmission solutions by 2030 [4].