势银观察 | 三维异构集成驱动热管理材料与技术创新

Core Viewpoint - The article discusses the advancements in three-dimensional heterogeneous integration technology for chips, emphasizing the importance of thermal management solutions in enhancing chip performance and addressing challenges related to heat dissipation [2][6]. Group 1: Three-Dimensional Heterogeneous Integration - The continuous miniaturization of AI computing chips and the doubling of transistor and interconnect density have led to the emergence of advanced packaging technologies, with three-dimensional heterogeneous integration becoming a key direction for improving chip performance [2]. - The introduction of vertical stacking of chips and copper-copper hybrid bonding processes has increased power density, making thermal management a critical consideration in chip packaging design [2][6]. Group 2: Thermal Interface Materials (TIMs) - Current commonly used TIMs include thermal grease and thermal pads, each with its advantages and limitations. Thermal grease has good flowability and filling capacity but limited thermal conductivity and can suffer from "pump-out effect" over time. Thermal pads are easier to install but are typically thicker and have higher contact thermal resistance due to limited elastic deformation [4]. - Innovative TIMs such as liquid metal TIMs (e.g., indium and gallium alloys) and nanostructured TIMs (e.g., carbon nanotubes, graphene) are being explored. Liquid metal TIMs offer significantly higher thermal conductivity (20-80 W/(m·K)) compared to traditional TIMs, while nanostructured TIMs exhibit excellent thermal performance but come with higher costs and reliability concerns [5]. Group 3: Upcoming Conferences and Industry Collaboration - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging, aiming to foster collaboration between industry and academia [6]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging technologies like TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [6]. Group 4: Advanced Cooling Solutions - The article highlights the limitations of air cooling for high-performance components, leading to the adoption of liquid cooling solutions, including immersion cooling and microfluidic cooling systems, which provide more efficient heat dissipation [8]. - Microfluidic cooling involves the use of internal microchannels to circulate coolant, enhancing heat absorption from components like CPUs, which is particularly important for three-dimensional stacked silicon wafers [8]. Group 5: Material Innovations - The use of glass-based packaging substrates and SiC ceramic substrates is being explored as alternatives to organic IC substrates, offering better thermal conductivity and reduced thermal accumulation, which could improve heat dissipation capabilities [8]. - The potential for industrial application of these materials is projected for around 2030, with ongoing assessments of process compatibility [8].