台积电先进封装，疯狂扩产

Core Viewpoint - TSMC is experiencing a surge in demand for advanced packaging due to the rapid development of AI chips, necessitating a shift in production timelines and strategies to meet client needs [2][5][6]. Group 1: Advanced Packaging Demand - TSMC's advanced packaging operations are under pressure to accelerate production timelines, with some projects needing to be completed within three quarters instead of the traditional longer timelines [2][5]. - The strong demand for AI chips is driving the need for advanced packaging solutions, highlighting the importance of TSMC's capabilities in this area [2][5][6]. Group 2: Organizational Changes - TSMC is establishing a dedicated organization for back-end advanced packaging, marking a significant shift in its operational structure and emphasizing the importance of this segment in the AI chip market [5]. - The new leadership for this segment will be taken on by Chen Cheng-hsien, who has extensive experience in TSMC's advanced packaging operations [5][6]. Group 3: Technological Advancements - TSMC has integrated advanced packaging into its 3DFabric platform, which includes various technologies such as TSMC-SoIC, CoWoS, and InFO, with plans for new technologies like CoWoS-L and SoW-X in the coming years [3][6]. - The SoIC technology, which allows for stacking multiple chip layers in a limited area, is expected to gain traction as AI chip demand grows, despite its current low production volume [6][7]. Group 4: Production Facilities - TSMC operates five advanced packaging facilities, with the most advanced located in Zhunan, and is expanding its capabilities with new facilities in Chiayi [7]. - The upcoming facilities will focus on CoPoS and SoIC technologies, which are anticipated to become the mainstay of TSMC's advanced packaging offerings [7].